Process Engineer I-IV

About the Role

The engineer will perform all duties safely, adhering to company Environmental, Health, and Safety policies, and will protect intellectual property and confidential information. Responsibilities include hands‑on process engineering development, research, and evaluation to deliver semiconductor manufacturing solutions that meet or exceed customer requirements. The role involves data collection, analysis, and reporting, and requires effective collaboration within a matrix environment and interaction with internal and external customers. The engineer may also lead small projects and cross‑team initiatives while supporting product demonstrations and business development activities. • Perform duties safely and comply with EHS policies. • Protect company intellectual property and confidential information. • Develop and evaluate semiconductor process solutions. • Collect, analyze, and report project data. • Collaborate within a matrix organization and interface with customers. • Lead small projects and cross‑team initiatives. • Support product demos and business development activities. • Apply advanced dry etch/RIE and plasma science knowledge. • Utilize SPC and DOE for process optimization. • Train new engineers on Hitachi plasma etch systems. • Maintain thorough technical documentation and records.

Key Responsibilities

• ▸process development
• ▸etch process
• ▸process optimization
• ▸data analysis
• ▸project lead
• ▸customer interaction

What You Bring

Candidates must hold a BS, MS, or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field, with the appropriate combination of education and experience. Preferred experience includes developing plasma etch processes, working with semiconductor equipment, and operating in cleanroom or fab environments. Travel is limited to less than 5 %, but occasional trips to customer sites or Japan for training may be required. Required technical skills include advanced knowledge of dry etch/RIE, plasma science, and semiconductor metrology, as well as proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE). Strong analytical and problem‑solving abilities, manual dexterity, and the capability to train new engineers on Hitachi plasma etch systems are essential. Effective organization, flexibility to shift priorities, and excellent documentation and communication skills are also needed. The role demands reliability, independence, teamwork, and the willingness to work overtime or flexible schedules as needed. • Travel up to 5 %, including occasional trips to Japan. • Hold a BS/MS/PhD in chemical engineering, materials science, physics, or related field. • Prefer experience with plasma etch processes and cleanroom equipment. • Demonstrate strong analytical and problem‑solving skills.

Requirements

• ▸phd
• ▸plasma etch
• ▸cleanroom
• ▸rie
• ▸spc
• ▸doe

Benefits

Hitachi High‑Tech America, Inc. is hiring a Process Engineer for its NCP (Hillsboro, OR) facility (Job ID R0118374), posted on 2026‑01‑23. This full‑time role follows an onsite/hybrid work style with roughly 80 % onsite and 20 % remote work. The base salary range is $64,811.80 to $146,963.71 annually, with potential additional incentive compensation.

Work Environment

Hybrid